Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-09-19
2006-09-19
Brunsman, David (Department: 1755)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S105000, C216S106000, C106S287110, C106S287130, C106S287150, C106S287190, C106S287200, C106S287230, C106S287240, C106S287300, C106S287320, C148S022000, C252S079100, C252S079200, C252S079400, C427S098800, C427S099200, C427S118000
Reexamination Certificate
active
07108795
ABSTRACT:
The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.
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Bernards Roger F.
Bowers, Jr. Joseph Stanton
Carroll Benjamin T.
Kucera Alvin A.
Brunsman David
Electrochemicals Inc.
McAndrews Held & Malloy Ltd.
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