Composition and method for polishing a composite comprising tita

Details Composition and method for polishing a composite comprising tita Composition and method for polishing a composite comprising tita

1997-03-17

1998-05-26

Jones, Deborah

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

51309, 106 3, 1566361, 1566451, B24D 334

Patent

active

057563985

ABSTRACT:
An aqueous slurry is provided which is useful for the chemical-mechanical polishing of substrates containing titanium comprising: water, submicron abrasive particles, an oxidizing agent, and a combination of complexing agents comprising a phthalate compound and a compound which is a di- or tri-carboxylic acid with at least one hydroxyl group in an alpha position relative to one of the carboxyl groups.

REFERENCES:
patent: 4954142 (1990-09-01), Carr et al.
patent: 4959113 (1990-09-01), Roberts
patent: 5244534 (1993-09-01), Yu et al.
patent: 5382272 (1995-01-01), Cook et al.
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5476606 (1995-12-01), Brancaleoni et al.
"Pattern Density Effects in Tungsten CMP", Rutten et al., Proc. VMIC 1995, pp. 491-497, 1995.

Affiliated with

Also associated with

Rating

Composition and method for polishing a composite comprising tita does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition and method for polishing a composite comprising tita, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition and method for polishing a composite comprising tita will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1959578