Composition and method for polishing a composite comprising tita

Details Composition and method for polishing a composite comprising tita Composition and method for polishing a composite comprising tita

1997-07-08

1998-06-23

Jones, Deborah

Compositions

Etching or brightening compositions

252 795, 51309, 438692, C09K 1300, C09K 1302

Patent

active

057701032

ABSTRACT:
Aqueous slurries are provided, which are useful for the chemical-mechanical polishing of substrates comprising titanium, comprising: water, submicron abrasive particles, an oxidizing agent, and a mono-, di-, or tri-substituted phenol wherein at least one of the substituted functional groups is polar. Optionally the compositions may also comprise a compound to suppress the rate of removal of silica. The slurries are useful on substrates which also comprise tungsten, aluminum or copper.

REFERENCES:
patent: 4954142 (1990-09-01), Carr et al.
patent: 4959113 (1990-09-01), Roberts
patent: 5244534 (1993-09-01), Yu et al.
patent: 5382272 (1995-01-01), Cook et al.
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5476606 (1995-12-01), Brancaleoni et al.
Rutten et al., "Pattern Density Effects in Tungsten CMP", Jun. 27-29, 1995 VMIC Conference ISMIC-104/95/0491.

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