Printing – Stenciling – Stencils
Patent
2000-01-04
2000-10-31
Funk, Stephen R.
Printing
Stenciling
Stencils
B41C 114
Patent
active
061385611
ABSTRACT:
In a composition containing a photothermal conversion material, which is suitable for use in a method of perforating a heat-sensitive stencil sheet by ejecting a photothermal conversion material contained in a liquid from a liquid-ejecting means to transfer it together with said liquid onto a heat-sensitive stencil sheet, and then exposing said heat-sensitive stencil sheet to a visible or infrared ray to allow the photothermal conversion material to emit heat so that said heat-sensitive stencil sheet is perforated specifically at portions to which said photothermal conversion material has been transferred, the perforation can be efficiently performed by use of a liquid containing a photothermal conversion material by appropriately selecting boiling point and heat of vaporization of a major component of the liquid.
A composition for perforating a heat-sensitive stencil sheet containing a photothermal conversion material in a liquid, said liquid comprising a solvent having a boiling point of 50 to 250.degree. C. and a heat of vaporization of 200 cal/g or less in an amount of at least 50% by weight based on the total of said liquid. Said photothermal conversion material is preferably carbon black in an amount of 0.1 to 30% by weight of the composition.
REFERENCES:
patent: 3151548 (1964-10-01), Picking
patent: 4139759 (1979-02-01), Hayama et al.
patent: 4268615 (1981-05-01), Yonezawa
patent: 4423676 (1984-01-01), Neel
patent: 4504553 (1985-03-01), Aubert et al.
patent: 4585815 (1986-04-01), Ono et al.
patent: 4961377 (1990-10-01), Bando et al.
patent: 5073698 (1991-12-01), Stultz
patent: 5156089 (1992-10-01), McCue et al.
patent: 5221561 (1993-06-01), Flicstein et al.
patent: 5312654 (1994-05-01), Arimatsu et al.
patent: 5339737 (1994-08-01), Lewis et al.
patent: 5483883 (1996-01-01), Hayama
patent: 5655446 (1997-08-01), Watanabe
patent: 5662039 (1997-09-01), Wantanabe et al.
patent: 5857410 (1999-01-01), Watanabe
patent: 5924359 (1999-07-01), Watanabe
patent: 5924361 (1999-07-01), Watanabe
LandOfFree
Composition and method for perforating heat-sensitive stencil sh does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composition and method for perforating heat-sensitive stencil sh, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition and method for perforating heat-sensitive stencil sh will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2039976