Composition and method for improving adhesion of coatings to cop

Details Composition and method for improving adhesion of coatings to cop Composition and method for improving adhesion of coatings to cop

1990-02-16

1991-08-06

Pal, Asok

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 41, 156656, 156666, 252 791, 252 794, B08B 308

Patent

active

050374826

ABSTRACT:
A composition for cleaning and improving the adhesion characteristics of a copper surface (which is in turn adhered to an underlying substrate) so as to enable a coating, e.g., of photoresist, to be adhered easily and completely to the copper surface, the cleaning and adhesion promoting composition consisting essentially of an aqueous solution of an alkane sulfonic acid, a surfactant and an oxidizing agent of a type, and present in an amount, sufficient to provide controlled conversion of the copper surface to a substantially clean, micro-roughened surface, without removing the copper surface from the underlying substrate, so that the adhesion characteristics of the copper surface are substantially increased for receiving and securely adhering a subsequently applied coating.

REFERENCES:
patent: 4921571 (1990-05-01), Kukanskis et al.
patent: 4944851 (1990-07-01), Cordani et al.
patent: 4957653 (1990-09-01), Cordani

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