Stock material or miscellaneous articles – All metal or with adjacent metals – Having aperture or cut
Patent
1989-07-10
1991-03-05
Dean, R.
Stock material or miscellaneous articles
All metal or with adjacent metals
Having aperture or cut
428626, 428674, 428675, 428901, B32B 1502
Patent
active
049977229
ABSTRACT:
The present invention comprises an improvement in the surface treatment of copper surfaces. It produces a strong and stable bond, resistant to chemical attack and to thermal and mechanical stresses between said copper foil surfaces and adjacent surfaces of resinous layers. It is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. In a method according to the invention, an oxidized copper surface is reduced in the presence of a polymer addition agent, and the partially reduced surface is then exposed to a nonoxidizing reagent. The result is a reticulated metallic copper microstructure capable of forming a strong adhesive bond with a resinous substrate, and having a high resistance to thermal, mechanical, and chemical (e.g. acid) stress.
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New Copper Surface Treatment for Polyimide Multilayer Printed Wiring Boards, by Haruo Akahoshi et al., Printed Circuit World Convention IV (1987).
New Copper Surface Treatment for Polyimide Multilayer PWBs, by Haruo Akahoshi et al., PC FAB, Jan. 1990.
Innerlayer Treatment with Electroless Copper Plating, by A. Nakaso et al., PC FAB, Nov. 1989, pp. 101-106.
Dean R.
Wyszomierski George
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