Composition and method for gold plating

Details Composition and method for gold plating Composition and method for gold plating

1980-03-20

1981-03-03

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 46G, C25D 348, C25D 362

Patent

active

042539200

ABSTRACT:
A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of a phosphate electrolyte, 1-hydroxyethylidene-1,1-diphosphonic acid, metal constituent, alkali metal gold cyanide and a small amount of free alkali metal cyanide. The bath is maintained at a pH of 3.0-13.0 and operated at a current density of 0.1-165 amperes per square decimeter.

REFERENCES:
patent: 2660554 (1950-11-01), Ostrow
patent: 3672969 (1972-06-01), Nobel et al.
patent: 3706634 (1972-12-01), Kowalski
patent: 3770596 (1973-11-01), Bick et al.
patent: 3856638 (1974-12-01), Bick et al.
patent: 3870619 (1975-03-01), Weisberg et al.
patent: 3904493 (1975-09-01), Losi et al.
patent: 4186064 (1980-01-01), Morrisey
patent: 4197172 (1980-04-01), Fletcher et al.

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