Composition and method for electrodeposition of copper

Details Composition and method for electrodeposition of copper Composition and method for electrodeposition of copper

1980-02-19

1981-06-09

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

2602451, C25D 338

Patent

active

042723353

ABSTRACT:
A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating bath having dissolved therein a brightening amount of a compound comprising a substituted phthalocyanine radical. In accordance with a preferred embodiment, the composition and method further includes in the copper plating bath secondary brightening agents including aliphatic polysulfides and/or organic sulfides and/or polyethers, as well as other known additives for acid copper plating baths.

REFERENCES:
patent: 2197860 (1940-04-01), Gassner et al.
patent: 3484450 (1969-12-01), Schundehutte et al.
patent: 4039346 (1977-08-01), Kranz

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