Composition and coating to prevent current induced electrochemic

Details Composition and coating to prevent current induced electrochemic Composition and coating to prevent current induced electrochemic

1990-02-09

1991-08-06

James, Andrew J.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 71, 357 68, 357 80, 428675, 427 96, M01L 2348

Patent

active

050381954

ABSTRACT:
The present invention comprises the use of a copper
ickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

REFERENCES:
patent: Re31967 (1985-08-01), Burns
patent: 3645785 (1972-02-01), Hentzschel
patent: 4301188 (1981-11-01), Niehaus
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4717591 (1988-01-01), Acosta et al.
IBM Technical Disclosure Bulletin, vol. 18, No. 15, 10-75, "Depositing Adhesion Layers for Contact Between Noble Metals and Dielectric Material", by Romankiw.

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