Composition

Details Composition Composition

2011-04-19

2011-04-19

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

Plural joints

C228S222000

Reexamination Certificate

active

07926696

ABSTRACT:
A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component.

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