Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-04-28
2000-03-14
Guay, John
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, H01L 2342, H01L 2334
Patent
active
060376597
ABSTRACT:
A composite thermal interface pad is comprised of a template portion formed from a material such as thermal gap pad material or thermal tape, in which cavities have been formed and filled with a pliable non-resilient material, such as thermal grease or thermal putty. The spacing and size of the cavities may be tailored to achieve desired elastic properties and stress distributions, as well as optimize the thermal characteristics of the thermal interface with respect to heat distribution patterns of electronic components being cooled. The composite thermal interface pad may also be used to provide EMI shielding along the gap formed between the electronic component and the adjacent cooling structure by filling closely adjacent cavities with electrically conductive non-resilient material. In one embodiment, an adjacent structure is provided with projection features that dig into the non-resilient material, thereby ensuring a good thermal interface, increasing the surface area available for thermal transfer, and minimizing the distance between the electronic component and the adjacent structure used for cooling.
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"Thermally Enhanced Tape Automated Bonded Package." IBM Technical Disclosure Bulletin, vol. 31, No. 5, Oct. 1998, pp. 34-35, XP002085961, New York.
Guay John
Hewlett--Packard Company
Plettner David A.
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