Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1983-12-05
1985-12-10
Kimlin, Edward
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156268, 156270, 156353, 156361, 156523, 156540, 156584, 156249, B29C 2722, B65H 1746, B32B 3100
Patent
active
045577838
ABSTRACT:
An improved method and apparatus for compacting a composite tape tail which is formed by making a cut along an oblique line across the tape and manipulating first and second compaction means. The cut, however, severs only the tape while it is adhered to the backing but does not sever the backing or subjacent support (which is usually a strip of paper). The backing is then peeled away from the strip at a location between the first compaction means shoe, blade, or pad) and a second compaction means (preferably a roller) and conveys the discarded portion of tape to storage, disposal etc. The first compaction means bears down on the assembly of tape and backing. The second compaction means engages the tape after the peeling away, hence bears down on only the tail. Only one compaction means is used at a time. The second compaction means compactingly engages the tail not later than the arrival of the tail leading edge at said second means by which time the first compacting means has stopped compacting. Power means, such as an air cylinder, move or switch the two compaction means into and out of respective positions for compaction so that the full width tape is compacted by the first compaction means and the tail (oblique strip without any backing) is compacted by the second compaction means.
REFERENCES:
patent: 3574040 (1971-04-01), Chitwood et al.
patent: 3775219 (1973-11-01), Karlson et al.
patent: 3810805 (1974-05-01), Goldsworthy et al.
patent: 4133711 (1979-01-01), August
patent: 4285752 (1981-08-01), Higgins
patent: 4292108 (1981-09-01), Weiss et al.
patent: 4328061 (1982-05-01), Off et al.
Grone Robert J.
Schnell Leonard R.
Vearil Wayne L.
Cincinnati Milacron Inc.
Hoch Ramon R.
Kimlin Edward
Worth Daniel P.
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