Composite substrates for preparation of printed circuits

Details Composite substrates for preparation of printed circuits Composite substrates for preparation of printed circuits

1995-06-07

1996-10-15

McCamish, Marion E.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428458, 428901, 252512, 252513, 252514, 252518, H01B 102, H01B 122

Patent

active

055652670

ABSTRACT:
Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180.degree. and about 245.degree. C., or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

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