Composite substrates for preparation of printed circuits

Details Composite substrates for preparation of printed circuits Composite substrates for preparation of printed circuits

1994-01-26

1996-07-23

McCamish, Marion E.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428413, 428418, 428458, 428901, 252512, 252513, 252514, 252518, H01B 102, H01B 122

Patent

active

055387896

ABSTRACT:
Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180.degree. and about 245.degree. C., or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

REFERENCES:
patent: 4077927 (1978-03-01), McPherson
patent: 4118535 (1978-10-01), Banucci et al.
patent: 4163030 (1979-07-01), Banucci et al.
patent: 4327124 (1982-04-01), DesMarais, Jr.
patent: 4353954 (1982-10-01), Yamaoka et al.
patent: 4368281 (1983-01-01), Brummett et al.
patent: 4396666 (1983-08-01), Ernsberger
patent: 4457861 (1984-07-01), DesMarais, Jr.
patent: 4686653 (1987-08-01), Iwasa
patent: 4789411 (1988-12-01), Eguchi et al.
patent: 4839229 (1989-06-01), Jellinek et al.
patent: 4876120 (1989-10-01), Belke et al.
patent: 4942095 (1990-07-01), Buchert et al.
patent: 4985297 (1991-01-01), Tamaru et al.
patent: 4996005 (1991-02-01), Saito et al.
patent: 5002818 (1991-03-01), Licari et al.
patent: 5043102 (1991-08-01), Chen et al.
Rutledge, G. C., "Modeling Chain Rigidity and Orientation in Liquid Crystalline Polymers", Polymer Preprints 33(1):537 (1992).

Affiliated with

Also associated with

Rating

Composite substrates for preparation of printed circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite substrates for preparation of printed circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite substrates for preparation of printed circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-711686