Composite substrate with high heat conduction

Details Composite substrate with high heat conduction Composite substrate with high heat conduction

1983-04-21

1985-10-08

Epstein, Henry F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Honeycomb-like

174 16HS, 361386, B32B 312

Patent

active

045460280

ABSTRACT:
A composite substrate, electrically insulating and with high heat conduction, for semiconductor circuits housing. It comprises principally an electrically insulating material such as alumina, in the form of a honeycombed wafer with cells, and a heat conducting material placed in said cells, such as a metal.

REFERENCES:
patent: 3068016 (1962-12-01), Dega
patent: 3210233 (1965-10-01), Kummer et al.
patent: 3829598 (1974-08-01), Darnell
patent: 3844011 (1974-10-01), Davies
patent: 3923940 (1975-12-01), Hujii et al.
patent: 3970324 (1976-07-01), Howat
patent: 4252391 (1981-02-01), Sado
patent: 4256792 (1981-03-01), Koepke
patent: 4407878 (1983-10-01), Smith et al.

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