Composite substrate for printed circuits and printed circuit-sub

Details Composite substrate for printed circuits and printed circuit-sub Composite substrate for printed circuits and printed circuit-sub

1985-07-16

1987-08-25

Kittle, John E.

Stock material or miscellaneous articles

Composite

Of quartz or glass

428433, 428469, 428471, 428552, 428701, 428901, 501 77, B32B 1500, B32B 900, B22F 300, C03C 3087

Patent

active

046892702

ABSTRACT:
To permit firing a composite carrier for a printed circuit in which the carrier has a base of metal, typically steel, and thus is highly vibration and bending resistant, the coating or cover layer is a glass ceramic of BaO-Al.sub.2 O.sub.3 -SiO.sub.2, typically 25 to 40%, preferably 35% of BaO, 5 to 20%, preferably 10% Al.sub.2 O.sub.3 and 40 to 65%, preferably about 55% SiO.sub.2. Rather than using 40 to 65% SiO.sub.2, a lesser quantity of SiO.sub.2, e.g., 30 to 65% may be used and then 0 to 15% MgO, 0 to 15% CaO, 0 to 5% SrO, 0 to 2% B.sub.2 O.sub.3, 0 to 4% PbO, 0 to 3% ZnO and 0 to 4% TiO.sub.2 may be applied. The glass ceramic may be dyed, for example by an inorganic dye, such as cobalt silicate, and standard resistor and conductor pastes, such as Cermalloy or Heraprint may be applied and fired at temperatures below 980.degree. C., and entirely suitable for firing temperatures above 850.degree. C. The coating or cover layer has a thickness of above 20 micrometers, preferably of between about 0.03 to 0.06 mm.

REFERENCES:
patent: 4256796 (1981-03-01), Hang et al.
patent: 4309507 (1982-01-01), Davis et al.
patent: 4315054 (1982-02-01), Sack et al.
patent: 4385127 (1983-05-01), Chyung
patent: 4410598 (1983-10-01), Kuzel et al.
patent: 4517217 (1985-05-01), Hoffman

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