Composite substrate for integrated circuits

Details Composite substrate for integrated circuits Composite substrate for integrated circuits

1987-02-18

1988-10-04

Kittle, John E.

Stock material or miscellaneous articles

Composite

Of quartz or glass

428209, 428210, 428428, 428901, 501 7, 501 43, B32B 1500, C03C 1012, C03C 323

Patent

active

047755962

ABSTRACT:
This invention is particularly directed to the preparation of inorganic ceramic laminated structures for use as substrates in integrated circuit packages. One lamina is composed of a high thermal conductivity material, the second lamina is composed of a low thermal conductivity material having a dielectric constant below 10, a sintering temperature below 1050.degree. C., and a linear coefficient of thermal expansion compatible with that of the other lamina, and a bonding medium sealing the two laminae together exhibiting flow at a temperature below the sintering temperature of the second lamina and a linear coefficient of thermal expansion compatible with those of the two laminae.

REFERENCES:
patent: 3978316 (1976-08-01), Ross et al.
patent: 4323652 (1982-04-01), Baudry et al.
patent: 4490429 (1984-12-01), Tosaki et al.

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