Composite substrate for heat-generating semiconductor device and

Details Composite substrate for heat-generating semiconductor device and Composite substrate for heat-generating semiconductor device and

1997-03-10

1999-11-09

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Laterally noncoextensive components

428620, 257712, 361710, B32B 1520, H01L 2314

Patent

active

059810858

ABSTRACT:
A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matrix, and a metal layer provided onto one main surface of the composite layer, wherein either one of a heat-generating semiconductor device or a substrate with low thermal expansion properties having a heat-generating semiconductor device provided thereon, is mounted on the other main surface of the composite layer.

REFERENCES:
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patent: 5039577 (1991-08-01), Knoel et al.
patent: 5132776 (1992-07-01), Hanada et al.
patent: 5259436 (1993-11-01), Yun et al.
patent: 5526867 (1996-06-01), Keck et al.
patent: 5533257 (1996-07-01), Romero et al.
patent: 5570502 (1996-11-01), Sawtell et al.

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