Heat exchange – Heat transmitter
Patent
1997-05-06
1999-08-31
Lazarus, Ira S.
Heat exchange
Heat transmitter
165 802, 165 803, 164 97, 164 6, 427249, 428209, 257720, F28F 700
Patent
active
059440970
ABSTRACT:
A substrate carrier for a ceramic substrate which supports one or more high power semiconductor devices which is fabricated from a metal base composite and which includes strategically located high conductivity copper based inserts to provide an effective heat transfer path to a heat sink for high power electronic devices. The coefficient of thermal expansion of both the metal based composite and the copper based inserts substantially match that of the substrate. The substrate carrier is formed by a pressure casting process where a porous preform of SiC, for example, is infiltrated with molten aluminum.
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Gardner, Jr. J. Donald
Gungor Mehmet N.
Larimer William R.
Lazarus Ira S.
McKinnon Terrell
Northrop Grumman Corporation
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