Composite stencil for screen printing

Details Composite stencil for screen printing Composite stencil for screen printing

1991-02-04

1991-09-10

Burr, Edgar S.

Printing

Stenciling

Stencils

101129, B05C 1706

Patent

active

050464159

ABSTRACT:
A composite stencil for screen printing solder paste includes a layer of metalic material such as brass and a layer of flexible material bonded to the metalic layer. The metalic layer has a thickness of 0.002 to 0.010 inches, while the flexible layer is 0.002 to 0.010 inches thick. The combined thickness of the composite stencil is approximately 0.008 to 0.012 inches. The stencil can be manufactured by forming openings in the metalic sheet and then applying a layer of photosensitive flexible material to the metalic sheet. The metalic sheet is then used as a stencil to expose the photosensitive material.

REFERENCES:
patent: 2829460 (1958-04-01), Golay
patent: 4091727 (1978-05-01), Hasegawa et al.
patent: 4096308 (1978-06-01), Reed
patent: 4142464 (1979-03-01), Rauch
patent: 4401520 (1983-08-01), Steppan et al.
patent: 4529477 (1985-07-01), Lundherg et al.
Circuits Manufacturing, Sep. 1985, vol. 25, No. 9, "Better Solder Printing with Stencils?".

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