Composite stacked semiconductor device with contact plates

Details Composite stacked semiconductor device with contact plates Composite stacked semiconductor device with contact plates

1992-06-22

1994-08-30

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257696, 257712, 257723, 361744, H01L 2302

Patent

active

053430751

ABSTRACT:
A composite semiconductor device comprises a multilayer wiring board, a plurality of resin-sealed semiconductor devices having external leads projecting from the opposite sides thereof and stacked one on another, on a multilayer wiring board, and contact plates provided with wiring lines on the inner surfaces thereof and disposed close to the opposite sides of the resin-sealed semiconductor devices, respectively, with the wiring lines in electrical contact with the external leads of the resin-sealed semiconductor devices, respectively. Since the resin-sealed semiconductor devices are stacked, the degree of integration of the resin-sealed semiconductor devices is multiplied by the number of the resin-sealed semiconductor devices so stacked. Since the resin-sealed semiconductor devices are electrically interconnected by the wiring lines of the contact plates, the multilayer wiring board need not be provided with any wiring for electrically interconnecting the resin-sealed semiconductor devices.

REFERENCES:
patent: 5016138 (1991-05-01), Woodman
patent: 5043794 (1991-08-01), Tai et al.
patent: 5051865 (1991-09-01), Kato
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5281852 (1994-01-01), Normington

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