Metal treatment – Stock
Patent
1994-06-20
1996-05-28
Lacey, David L.
Metal treatment
Stock
420560, 420561, 420562, 420557, 148405, 428614, C22C 1300, C22C 1302
Patent
active
055207529
ABSTRACT:
A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniformly distributed and resist degradation on long-term aging. When added to commercial bulk or paste solders, the intermetallic particles reduce the lead content of solder joints by consuming volume in lead-tin solder, and improve the mechanical properties of the solder by inhibiting localized shear deformation and interfering with crack growth.
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Clough Roger B.
Hwang Jennie S.
Lucey, Jr. George K.
Wasynczuk James A.
Krosnick Freda L.
Lacey David L.
Roberto Muzio B.
The United States of America as represented by the Secretary of
Vincent Sean
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