Composite solder paste for flip chip bumping

Details Composite solder paste for flip chip bumping Composite solder paste for flip chip bumping

1995-09-29

1998-09-08

Ramsey, Kenneth J.

Metal fusion bonding

Solder form

2282485, 22818022, H01L 21441

Patent

active

058033408

ABSTRACT:
Composite solder paste compositions adapted to be deposited using a dry film photoresist mask to form solder joints for flip chip integrated circuit devices. The composite solder paste compositions are characterized by the ability to flow at a first temperature during bumping reflow while the photoresist mask is present, yet upon subsequently reheating to a higher temperature yield solder joints capable of withstanding temperatures of 200.degree. C. and higher. As such, the present invention retains the advantages associated with using a dry film photoresist as a mask during deposition of the solder, yet results in the formation of solder joints that exhibit enhanced reliability in severe thermal environments.

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Pavio, "Successful Alloy Attachment of GaAs MMIC's" IEEE Transactions of Electron Devices, No. 12, Dec. 1987.

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