Composite polymer/desiccant coatings for IC encapsulation

Details Composite polymer/desiccant coatings for IC encapsulation Composite polymer/desiccant coatings for IC encapsulation

1987-12-16

1990-07-03

Buffalow, Edith

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

428209, 428446, 428447, 428448, 428450, B32B 104

Patent

active

049390147

ABSTRACT:
This invention is directed to composite coating for maintaining low moisture levels at the surface of solid substrates. One embodiment of the invention comprises a coating a having a desiccant layer between layers of the same or different elastomeric polymers. Another embodiment comprises a layer of elastomeric polymer covered with a layer of an elastomeric polymer/desiccant mixture. The composite coating may be applied to integrated circuits to prevent corrosion thereof.

REFERENCES:
patent: 2368140 (1945-01-01), Johnson
patent: 2477203 (1950-02-01), Bennett
patent: 2771333 (1956-11-01), Eberle
patent: 2994404 (1961-08-01), Schifferly
patent: 3260234 (1966-07-01), Serrano et al.
patent: 3264248 (1966-08-01), Lee
patent: 3326810 (1967-06-01), Dolan
patent: 3975757 (1976-08-01), Sporck
patent: 4079511 (1978-03-01), Grabbe
patent: 4081397 (1978-03-01), Booe
patent: 4163072 (1979-07-01), Soos
patent: 4327369 (1982-04-01), Kaplan
patent: 4407897 (1983-10-01), Farrell et al.
patent: 4425410 (1984-01-01), Farrell et al.
patent: 4464443 (1984-08-01), Farrell et al.
patent: 4511705 (1985-04-01), Makino et al.
patent: 4542260 (1985-09-01), Pearce
patent: 4572853 (1986-02-01), Ikeya et al.
patent: 4576841 (1986-03-01), Lingemann
patent: 4595616 (1986-06-01), Bell et al.
patent: 4614963 (1986-09-01), Brettle et al.
patent: 4617584 (1986-10-01), Ikeye et al.
patent: 4792484 (1988-12-01), Moritani

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