Composite polishing pad for semiconductor process

Details Composite polishing pad for semiconductor process Composite polishing pad for semiconductor process

1991-07-09

1993-05-25

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51395, 51407, 511313, 51317, B24D 1100

Patent

active

052129101

ABSTRACT:
An improved composite polishing pad includes a first layer of elastic material, a second, stiff layer and a third layer optimized for slurry transport. This third layer is the layer against which the wafer makes contact during the polishing process. The second layer is segmented into individual sections physically isolated from one another in the lateral dimension. Each segmented section is resilient across its width yet cushioned by the first layer in the vertical direction. The physical isolation of each section combined with the cushioning of the first layer of material create a sort of "bedspring" effect which enables the pad to conform to longitudinal gradations across the wafer.

REFERENCES:
patent: 5127196 (1992-07-01), Morimoto et al.

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