Composite polishing pad

Details Composite polishing pad Composite polishing pad

1995-11-20

1997-03-11

Kisliuk, Bruce M.

Abrading

Flexible-member tool, per se

Interrupted or composite work face

451526, 451527, B24D 1100

Patent

active

056095171

ABSTRACT:
A composite polishing pad is provided, with a supporting layer, nodes attached to the supporting layer, and an upper layer attached to the supporting layer which surrounds but does not cover the nodes. The support layer, nodes, and upper layer may all be of different hardnesses.

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patent: 5297364 (1994-03-01), Tuttle
patent: 5329734 (1994-07-01), Yu
patent: 5396737 (1995-03-01), Englund et al.
patent: 5403228 (1995-04-01), Pasch
E. Mendel, "Process of Free Polishing Semiconductor Wafers", IBM Technical Disclosure Bulletin vol. 26, No. 7A, Dec. 1983, p. 3176.
Sumitomo Metal Industries presentation handout, May 16, 1994.

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