Composite polish pad for CMP

Details Composite polish pad for CMP Composite polish pad for CMP

1997-03-17

1999-08-31

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451287, 451 57, B24B 100

Patent

active

059445831

ABSTRACT:
A method and apparatus for polishing a semiconductor wafer using a polishing pad. Circumferential rings of alternating compressibility of hard and soft/sponge-like material are located in the polishing pad. The concentric rings may also be located off-center from the geometric center of the polishing pad.

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