Composite plating method

Details Composite plating method Composite plating method

1995-10-06

1997-07-29

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating contains embedded solid material

205112, 205133, 427454, 427258, 427470, 427466, C25D 1500, C25D 500, B05D 136

Patent

active

056518722

ABSTRACT:
A composite plating film is prepared from a composite plating solution containing a metal matrix and insoluble particles 4 dispersed therein or deposited therewith. The composite plating film has a non-uniform concentration of insoluble particles along a direction of the thickness of the composite film. The non-uniform concentration is achieved by changing the discharge rate of composite plating solution during deposition of the film on the base material.

REFERENCES:
Chemical Abstracts--abstract of Kawasaki et al., Kinzoku Hyomen Gijutsu, 1973, 24(4), 196-202 1973 no month available.
Chemical Abstracts--abstract of Hayashi et al., Interfinish 76, Tagungsberichtsband-Weltongr. Oberflaechenbehandl. Met., 9th (1976), Paper No. 18, 14 pp. 1976 no month available.
Chemical Abstracts--abstract of Ishimori et al., Kinzoku Hyomen Gijutsu, 1977, 28(10), 508-512 1977 no month available.
Chemical Abstracts--abstract of Perene et al., Tagungsband-Kammer Tewch. Suhl (1984), 74, 55-62 1984 no month available.
Tomaszewski et al., Codeposition of Finely Dispersed Particles with Metals, Plating, 1969, 1234-1239 1969 no month available.

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