Composite plating apparatus

Details Composite plating apparatus Composite plating apparatus

1997-10-17

2000-07-11

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204272, 204284, 204237, C25D 704, C25D 1700, C25D 1712

Patent

active

060867310

ABSTRACT:
A composite plating apparatus includes a cylindrical electrode which is positioned in a hollow section of a workpiece with a surrounding gap left therebetween. A plurality of through-holes are formed across the thickness of an outer wall of the cylindrical electrode. Composite plating liquid is jetted out through the through-holes and impinge on the inner surface of the hollow section to thereby produce turbulence. The turbulent liquid provides a uniform distribution of ceramic particles in the liquid. As a result, the ceramic particles can be co-deposited uniformly in a metallic matrix, and hence a uniform abrasion-resistant characteristic is obtained all over a resultant composite plating film.

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WPI Accession No. 94-141295/17 & JP 6088284 A (Abstract) No Date.
WPI Accession No. 93-089093/11 & JP 5033186 A (Abstract) No Date.
WPI Accession No. 90-088558/12 & JP 2043399 A (Abstract) No Date.
Communication from UK Patent Office and attached Search Report No Date.

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