Composite pallet

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

156643, 204298, C23F 102

Patent

active

044392613

ABSTRACT:
Disclosed is a composite pallet for a reactive ion etching system consisting of an upper surface made of an insulative material, such as, silicon having therein a plurality of recessed pockets for holding the wafers to be etched and a bottom surface made of conductive material, such as, aluminum for electrically and thermally communicating the wafers with the cathode. The pallet diameter is larger than that of the cathode, but due to the conductive bottom surface the cathode is effectively extended over the entire pallet diameter. Such an arrangement provides excellent etch uniformity over all portions of the pallet.

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C. J. Hendricks, "Cathode Plate for Backside Oxide Strip in an RIE Reactor", IBM Technical Disclosure Bulletin, vol. 23, No. 12, May 1981, pp. 5350-5351.
H. M. Gartner et al, "Achieving Uniform Etch Rates in Reactive Ion Plasma Etching Processes", IBM Technical Disclosure Bulletin, vol. 20, No. 7, Dec. 1977, p. 2703.

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