Composite of metal and resin having electrolytically reduced met

Details Composite of metal and resin having electrolytically reduced met Composite of metal and resin having electrolytically reduced met

1984-12-31

1987-04-28

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428612, 428626, 428675, B32B 1508

Patent

active

046614176

ABSTRACT:
A composite of metal and resin comprising a resin layer and a metal layer having a surface roughness of a degree giving a lusterless appearance and a color of olive brown to black closely adhered through said surface to the resin layer is excellent in adhesive strength between the metal and resin layers, the metal layer being excellent in acid resistance, and is suitable for producing printed circuit boards.

REFERENCES:
patent: Re30180 (1979-12-01), Wolski et al.
patent: 3220897 (1965-11-01), Conley et al.
patent: 3293109 (1966-12-01), Luce et al.
patent: 3918926 (1975-11-01), Wolski et al.
patent: 4311768 (1982-01-01), Berdan et al.
patent: 4496794 (1985-01-01), Darms et al.
patent: 4517254 (1985-05-01), Grapentin et al.

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