Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Patent
1998-10-06
2000-04-25
Palmer, Phan T. H.
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
385921, G02B 636
Patent
active
060536403
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an integrated module for optical fiber amplifiers.
BACKGROUND ART
Japanese laid-open patent publication No. 116118 of 1996, relates to an optical fiber amplifier and more particularly to an amplifying system where pumping light is sent from an LD element into an Er doped optical fiber via a signal light channel to produce an excited state in the abovementioned Er doped optical fiber. By inputting the signal light into the optical fiber amplifier and causing the light to pass through the Er doped optical fiber, the signal light is amplified and is outputted.
In order to generate pumping light sent into an Er doped optical fiber in an optical fiber amplifier, a laser diode (hereinafter merely called LD) element is used.
In recent years, on the basis of requests for shortening the work time in assembling optical fiber amplifiers and downsizing of mounting areas, several optical elements including an LD element are in advance integrated in one package to make an integrated module for an optical fiber amplifier, which would be incorporated in an optical fiber amplifier.
As an example of an integrated module for a conventional optical fiber amplifier, a so-called backward pumping type, in which pumping light is sent into an Er doped optical fiber in reverse of the signal light advancing direction is shown in FIG. 4(a) and FIG. 4(b).
As shown in FIG. 4(a) and FIG. 4(b), in the integrated module for an optical fiber amplifier, the respective optical elements (WDM filter component 5, optical isolator 6, beam splitter component 7) are mounted in a package consisting of a substrate 1 and side plates 2a through 2d erected at four sides of the substrate 1.
Sealing glass components 3a and 3b are, respectively, secured at the side plates 2a and 2b, wherein the first optical fiber 4a (signal light inputting portion) which inputs signal light into the abovementioned module and sends pumping light from the module to an Er doped optical fiber (not illustrated) is fixed outside one sealing glass component 3a, and the second optical fiber 4b (signal light outputting portion) which outputs the abovementioned signal light from the corresponding module is fixed outside the other sealing glass component 3b.
These first and second optical fibers 4a, 4b are disposed so that the end faces thereof are confronting each other, and a signal light channel X through which signal light goes, is formed from the optical fiber 4a to the optical fiber 4b via above the substrate 1.
Furthermore, a lens (not illustrated) which collimates light is provided between the sealing glass component 3a and optical fiber 4a and between the sealing glass component 3b and optical fiber 4b.
WDM filter component 5, optical isolator 6 and beam splitter component 7 are disposed and fixed at the part which is made into the signal light channel X on the substrate 1, after their beam axes are aligned with each other.
For example, as shown in FIG. 5, the WDM filter component 5 and beam splitter component 7 are such that they are accommodated and fixed, by cementing with low melting point glass or welding by a YAG laser or soldering, at a metal holder 8 consisting of Fe-Ni-Co based alloy (hereinafter called KOVAR), 42Ni-Fe (42 alloy) or stainless steel, etc., and they are directly fixed on the substrate 1 below the underside of the metal holder 8 by laser beam welding such as YAG laser welding, etc.
An LD element 9 which generates pumping light is disposed at the side of the WDM filter component 5.
A heat sink which quickly absorbs heat generated at the LD element 9 is fixed on the underside of the LD element 9, and a base 11 consisting of, for example, Cu or Cu-W based alloy is fixed on the underside of the heat sink, and a Peltier element 12 is attached to the underside of the base 11. Furthermore, the underside of the Peltier element 12 is fixed on the substrate 1 by brazing such as soldering or Ag brazing, etc.
Furthermore, 13 is a collimator lens which collimates pumping light emitted from the LD element 9.
Pho
REFERENCES:
patent: 5692084 (1997-11-01), Roff
patent: 5930430 (1997-11-01), Pan et al.
1.48.mu.m High-output LD Module (in Japanese) Anritsu Technical Bulletin, vol. 65 (19993) pp. 48-54.
Special Feature Semiconductor Laser Module (in Japanese) Research Developments, Oki electric Industry Co. Ltd. vo. 58, No. 3 (1991) pp. 33-36, No Month.
Miyokawa Jun
Takase Taijiro
Lacasse Randy W.
Palmer Phan T. H.
Strickland Wesley L.
The Furukawa Electric Co. Ltd.
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