Composite microwave circuit module assembly and its connection s

Wave transmission lines and networks – Long line elements and components – Strip type

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333247, 333 26, 333 99R, 361761, 361816, 455128, H03H 1102

Patent

active

054500460

ABSTRACT:
A composite microwave circuit module assembly has a dielectric substrate which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface and an upper ground surface, respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface and the lower ground surface so as to shield the radio frequency signal circuit. An element mounting cavity is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member. A connection terminal connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure having a contact member resiliently urged toward said connection terminal.

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By R. Pucel, "Design Considerations for Monolithic Microwave Circuits", Jun. 1981, vol. 29, No. 6, IEEE Trans. on Microwave Theory and Techniques, pp. 513-534, New York, USA.

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