Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component
Reexamination Certificate
2005-02-15
2005-02-15
Jones, Deborah (Department: 1775)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Composite having voids in a component
C428S312200, C428S312800, C428S314800, C428S315700, C428S317900, C428S319100, C428S457000
Reexamination Certificate
active
06855408
ABSTRACT:
A composite metallic material1according to the invention is used for, e.g., electrolytic capacitors, and includes a metallic material substrate10and a high polymer thin layer11having a fine pattern12formed on at least one surface of the substrate10by self-organization. This high polymer thin film11is formed by, for example, drying hydrophobic organic solvent solution of high polymer compound. By subjecting this composite metallic material1to etching processing, etching pits are formed uniformly with high density based on the fine pattern.
REFERENCES:
patent: 5895263 (1999-04-01), Carter et al.
patent: 6565763 (2003-05-01), Asakawa et al.
patent: 0 459 461 (1991-12-01), None
patent: 58-34925 (1983-07-01), None
patent: 61-51818 (1986-03-01), None
patent: 3-122260 (1991-05-01), None
patent: 8-253878 (1996-10-01), None
patent: 2000-251236 (2000-09-01), None
T. Gokawachi, Toshiba Review, vol. 56, No. 10, pp. 66-67, “Nanomaterial”, Oct. 1, 2001 (with Partial English translation).
Hosoda Yoshikazu
Koyama Tamami
Monden Ryuji
Sakaguchi Masashi
Shimomura Masatsugu
Jones Deborah
Showa Denko K.K.
Xu Ling X.
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