Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
1999-07-27
2001-07-17
Callahan, Timothy P. (Department: 2816)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S727000
Reexamination Certificate
active
06262476
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is directed to a composite member composed of at least two integrated electronic circuits, whereby principal services of the integrated electronic circuits are aligned essentially parallel to one another, and whereby the integrated electronic circuits comprise terminal lines in the region of at least one of their boundary surfaces.
The invention is also directed to a method for the manufacture of a composite member having at least two integrated electronic circuits, whereby principal surfaces of the integrated electronic circuits are aligned essentially parallel to one another, and whereby the integrated electronic circuits are provided with terminal lines in the region of at least one of their boundary surfaces.
A composite member of the type manufactured by Toshiba comprises two integrated circuits whose terminal lines are connected to one another by an additional contact element such as, for example, an auxiliary frame or a solder lug. The manufacture of these composite members is comparatively complicated.
SUMMARY OF THE INVENTION
The invention is based on the object of creating a composite member of the species that is structurally simplified. Moreover, a method of the species should be implemented with high dependability and in short clock times.
This object is inventively achieved in that a composite member of the species is fashioned such that at least a part of the terminal lines of one of the integrated electronic circuits is directly connected to at least one terminal line of another integrated electronic circuit.
Inventively, further, a method of the species for the manufacture of a composite member is implemented such that at least a part of the terminal lines of one of the integrated electronic circuits is directly connected to at least one terminal line of another integrated electronic circuit.
The invention thus provides that the composite member composed of at least two integrated electronic circuits, particularly of integrated electronic circuits that contain memory cell arrangements, be created in that terminal wires of the individual integrated electronic circuits are directly connected to one another, i.e. without interposition of terminal elements.
Such a composite member is preferably implemented as what is referred to as a stacked package. The individual integrated electronic circuits are thereby located immediately on one another, so that their principal surfaces touch. In this way, it is possible to arrange an optimally high plurality of integrated electronic circuits on an optimally small space.
Especially advantageously, the method is implemented such that at least a part of the connecting lines that are connected to other connecting lines are bent before connecting.
In order to achieve an especially durable, direct connection, it is expedient that the terminal lines are connected to one another by welding.
Especially high clock times as well as an especially high dependability of the process can be achieved in that the energy required for the welding is at least partially supplied by laser radiation.
An unambiguous addressing of function elements, particularly memory cells, can be achieved in that, before two terminal lines are connected to one another, one of the terminal lines is separated from an integrated electronic circuit with which it was in contact in a previous processing step.
It is thereby especially advantageous that the energy required for the parking of the terminal line from the integrated electronic circuit is at least partially supplied by laser radiation.
By using laser radiation both for the welding as well as for the parting, these two processing steps can be implemented in a single processing station, potentially even simultaneously.
REFERENCES:
patent: 4696525 (1987-09-01), Coller et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5479318 (1995-12-01), Burns
patent: 5508563 (1996-04-01), Tazawa et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5760471 (1998-06-01), Fujisawa et al.
Callahan Timothy P.
Nguyen Hai L.
Schiff & Hardin & Waite
Siemens Aktiengesellschaft
LandOfFree
Composite member composed of at least two integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composite member composed of at least two integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite member composed of at least two integrated... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2470583