Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1983-08-24
1984-08-28
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156242, B32B 3100
Patent
active
044682727
ABSTRACT:
First a quantity of reinforcing material is formed into a shaped mass bound together by an inorganic binder. Next, this shaped mass is compounded with a quantity of a molten matrix metal by a pressure casting method. The molten matrix metal includes a quantity of a certain element with a strong tendency to become oxidized, and the inorganic binder includes a metallic oxide which, when brought into contact at high temperature with this certain element, is reduced thereby in an exothermic reaction. Thus, during the pressure casting, extra heat is produced as the certain element reduces the metallic oxide, and this aids good penetration of the matrix metal into the interstices of the reinforcing material. The metal remaining from the oxide is dispersed in the matrix metal. This metallic oxide may be silica, zirconia, chromium oxide, yttrium oxide, cerium oxide, ferric oxide, zirconium silicate, antimony oxide, or a mixture thereof; and the certain element may be lithium, calcium, magnesium, aluminum, beryllium, titanium, zirconium, or a mixture thereof.
REFERENCES:
patent: 3550247 (1970-12-01), Evans et al.
patent: 3816158 (1974-06-01), Jacobs
Donomoto Tadashi
Tanaka Atsuo
Tatematsu Yoshiaki
Powell William A.
Toyota Jidosha & Kabushiki Kaisha
LandOfFree
Composite material manufacturing method exothermically reducing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composite material manufacturing method exothermically reducing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite material manufacturing method exothermically reducing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-876149