Composite material having polypropylene resin molded body and po

Details Composite material having polypropylene resin molded body and po Composite material having polypropylene resin molded body and po

1998-10-16

2000-08-01

Michl, Paul R.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

B32B 518

Patent

active

060964170

ABSTRACT:
A composite material including a polypropylene resin molded body having a melting point MB.degree. C., and a foamed body of expanded particles fuse-bonded to the molded body, wherein the foamed body has at least two endothermic peaks in DSC curve thereof at peak temperatures of 135.degree. C. or more, wherein the highest temperature endothermic peak thereof is at a peak temperature of PH.degree. C. which is not lower than (MB-5).degree. C. and has such an area at temperatures not lower than (MB-5).degree. C. that corresponds to a calorific value in the range of at least 8 J/g, and wherein the peel strength between the molded body and the foamed body is at least 1.5 kg/15 mm. The composite material is produced by molding the expanded particles in a mold cavity in which the molded body is previously placed.

REFERENCES:
patent: 5474841 (1995-12-01), Matsuki
patent: 5709925 (1998-01-01), Spengler
patent: 5928776 (1999-07-01), Shioya

Affiliated with

Also associated with

Rating

Composite material having polypropylene resin molded body and po does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite material having polypropylene resin molded body and po, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite material having polypropylene resin molded body and po will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-661680