Composite material for mounting electronic devices

Details Composite material for mounting electronic devices Composite material for mounting electronic devices

1980-01-29

1982-03-16

James, Andrew J.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 65, 357 67, 357 71, 357 81, 428594, 428620, 428629, H01L 2348, H01L 2944, H01L 2952

Patent

active

043204120

ABSTRACT:
A lead frame for mounting semiconductor chips includes laminated chip-mounting portions. These portions are comprised of a high thermal conductivity lead-frame material laminated with upper and lower surfaces of a material which matches the expansivity of the semiconductor. These upper and lower surfaces prevent warping of the mounting portions and this, coupled with the matching of the expansivity of the chip, greatly reduces the likelihood of chip damage.

REFERENCES:
patent: 2796563 (1957-06-01), Ebers et al.
patent: 2964830 (1960-12-01), Henkel et al.
patent: 3143684 (1964-08-01), MIller
patent: 3296501 (1967-01-01), Moore
patent: 3334279 (1967-08-01), Lueck
patent: 3351700 (1967-11-01), Savolainen
patent: 3399332 (1968-08-01), Savolainen
patent: 3969754 (1976-07-01), Kuniya et al.
patent: 4025997 (1977-05-01), Gernitis et al.
patent: 4283464 (1981-08-01), Hascoe
Inlax Clad Metals; Electronic Design 3 Feb. 1, 1977, p. 11.
Laser Heat Sink; by Johnson, vol. 7 No. 9, Feb. 1965; IBM Technical Bulletin.

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