Composite material for electronic part and method of producing s

Details Composite material for electronic part and method of producing s Composite material for electronic part and method of producing s

1997-05-07

2000-04-04

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Laterally noncoextensive components

428635, 428676, 257712, 257720, 361709, H01L 23373, B32B 324

Patent

active

060459271

ABSTRACT:
There is disclosed a composite material for an electronic part which has high thermal conductivity in a laminated direction, and also has low-thermal expansion characteristics. The composite material, used for a heat sink or a heat spreader, includes high-thermal conductivity layers of copper or a copper alloy and low-thermal expansion layers of a Fe--Ni alloy which are alternatively laminated to form a multi-layer structure having not less than 10 layers and preferably not less than 50 layers. Any two adjacent ones of the high-thermal conductivity layers, having the low-thermal expansion layer interposed therebetween, are continuous with each other through a plurality of through holes formed through the low-thermal expansion layer. This composite material can be produced by a method in which thin sheets of copper or a copper alloy and thin sheets of a Fe--Ni alloy (having a plurality of through holes) are alternatively stacked, and this stack is sealed in a vacuum not higher than 10-3 Torr, and the stack of layers is subjected to a bonding treatment at a temperature of 700 to 1,050.degree. C. under a pressure of not less than 50 MPa to provide a laminated structure, and this laminated structure is rolled into a sheet with a predetermined thickness.

REFERENCES:
patent: 3295935 (1967-01-01), Pflumm et al.
patent: 3368122 (1968-02-01), Fishman et al.
patent: 3399332 (1968-08-01), Savolainen
patent: 4283464 (1981-08-01), Hascoe
patent: 4427993 (1984-01-01), Fichot et al.
patent: 4482912 (1984-11-01), Chiba et al.
patent: 4996115 (1991-02-01), Eerkes et al.
patent: 5106433 (1992-04-01), Nakamura et al.
patent: 5156923 (1992-10-01), Jha et al.
patent: 5300809 (1994-04-01), Nakamura et al.
patent: 5358795 (1994-10-01), Nakamura et al.

Affiliated with

Also associated with

Rating

Composite material for electronic part and method of producing s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite material for electronic part and method of producing s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite material for electronic part and method of producing s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-363299