Composite material

Details Composite material Composite material

2005-10-11

2005-10-11

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Metal compound containing

C428S307700, C428S312800, C428S313900, C428S472000, C423S290000, C423S291000, C423S345000, C423S439000, C501S088000, C501S092000, C420S469000

Reexamination Certificate

active

06953539

ABSTRACT:
A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.

REFERENCES:
patent: 5595622 (1997-01-01), Pyzik et al.
patent: 6110577 (2000-08-01), Ishikawa et al.
patent: 6183874 (2001-02-01), Yamagata et al.
patent: 501539 (1992-09-01), None
patent: 59-228742 (1984-12-01), None
patent: 04-097975 (1992-03-01), None
patent: 8-279569 (1996-10-01), None
patent: P2000-174183 (2000-06-01), None
patent: 2000-174183 (2000-06-01), None
patent: WO 01/34535 (2001-05-01), None
U.S. Appl. No. 09/913,353, filed Aug. 13, 2001, Ishikawa et al.

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