Composite integrated circuit device having restricted heat...

Details Composite integrated circuit device having restricted heat... Composite integrated circuit device having restricted heat...

2005-10-11

2005-10-11

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S774000, C257S773000, C257S676000, C257S691000, C257S693000, C257S678000, C257S687000, C257S680000, C257S698000, C257S723000, C257S685000, C257S728000, C257S724000, C257S668000, C361S760000, C361S783000, C361S776000, C361S728000, C174S260000, C174S255000

Reexamination Certificate

active

06953987

ABSTRACT:
A composite integrated circuit is formed by being molded with a mold resin, including a seat member of a lead frame, a substrate attached on the seat member of the lead frame, a heater element, and a temperature-restricted element. Here, the heater element and the temperature-restricted element are mounted on the substrate. The seat member of the lead frame includes a hollow member that is located under an intermediate area between the heater element and the temperature-restricted element.

REFERENCES:
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 5264730 (1993-11-01), Matsuzaki et al.
patent: 5305179 (1994-04-01), Sono et al.
patent: 5397915 (1995-03-01), Nose
patent: 5426405 (1995-06-01), Miller et al.
patent: 5492842 (1996-02-01), Eytcheson et al.
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 6259157 (2001-07-01), Sakamoto et al.
patent: 6484708 (2002-11-01), Hirakawa et al.
patent: 6579623 (2003-06-01), Kurihara et al.
patent: 6624511 (2003-09-01), Sakamoto et al.
patent: 6630748 (2003-10-01), Sato et al.
patent: 2004/0007384 (2004-01-01), Soga et al.
patent: 6-45476 (1994-02-01), None
patent: 6-140274 (1994-05-01), None
patent: A-7-66355 (1995-03-01), None
patent: A-9-293802 (1997-11-01), None
patent: A-2001-77270 (2001-03-01), None
patent: 2003-51578 (2003-02-01), None

Affiliated with

Also associated with

Rating

Composite integrated circuit device having restricted heat... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite integrated circuit device having restricted heat..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite integrated circuit device having restricted heat... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3480685