Composite housing for a computer system

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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Details

174 35R, 428622, 428623, 428624, 427300, 425542, 425543, 295921, H05K 900, H01S 400, B21D 3900

Patent

active

051645424

ABSTRACT:
A modular computer system is disclosed that includes a self-contained work-slate unit having a housing comprising a dense layer forming an external surface of the housing, a first layer of woven structural fiber material overlaying the relatively high density layer, a layer of closed cell foam material overlaying the first layer of structural fiber material preferably woven, a second layer of woven structural material overlaying the layer of closed cell foam material, a layer of electro-magnetic shielding material overlaying the second layer of woven structural material and a third layer of woven structural fiber material overlaying the layer of electromagnetic shielding. The first, second and third layers of woven structural fibers, the layer of electro magnetic shielding and the layer of closed cell foam are permeated with a thermoset resin for binding the respective layers of the composite housing together.

REFERENCES:
patent: 3112221 (1963-11-01), Price
patent: 3230375 (1966-01-01), Wagoner et al.
patent: 4828931 (1989-05-01), Ogawa et al.
patent: 4831210 (1989-05-01), Larson et al.
patent: 4896001 (1990-01-01), Pitts et al.

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