Composite high-frequency component

Wave transmission lines and networks – Plural channel systems – Having branched circuits

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333134, 333204, H01P 115, H01P 512

Patent

active

059990651

ABSTRACT:
A composite high-frequency component is designed to occupy a smaller area and a smaller volume when mounted in an apparatus, can be located in the apparatus with improved flexibility, and is able to operate without an impedance matching circuit. The composite high-frequency component includes a multilayer substrate, diodes constituting a high-frequency switch component, and a circuit base. External terminals for connection to a transmitting circuit, a receiving circuit and an antenna, external terminals for control and an external terminal for connection to ground potential are formed on an outer surface of the multilayer substrate. Strip lines and capacitors constituting the high-frequency switch and strip lines and capacitors constituting a low-pass filter circuit are formed in the multilayer substrate.

REFERENCES:
patent: 5513382 (1996-04-01), Agahi-Kesheh et al.
patent: 5525942 (1996-06-01), Horii et al.
patent: 5594394 (1997-01-01), Sasaki et al.
patent: 5783976 (1998-07-01), Furutani et al.
H. Mandai, et al., "Advanced Multi-Layer Ceramic Surface-Mount Functional Components", 45th Electronic Components and Technology Conference, May 21-24, 1995, Las Vegas, US, pp. 247-250.
Y. Taguchi, et al., "Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors", IEICE Transactions of Electronics, Jun., 1993, vol. E76-C, No. 6, Tokyo, Japan.

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