Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-09-02
1999-09-07
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 361708, 361719, 361721, 361752, 361796, 174 161, 174 163, 165 802, 165185, H05K 720
Patent
active
059496509
ABSTRACT:
A heat sink board structure includes a thermal/structural base having a composite core layer of a mass of graphitized carbon fibers infiltrated with a first resin material matrix. The graphitized carbon fibers of the composite core are substantially unidirectional and oriented parallel to the face of the composite core layer. Transverse reinforcement layers are bonded to the oppositely disposed faces of the composite core layer. Each transverse reinforcement layer is formed of carbon fibers embedded in a resin material matrix, with the carbon fibers lying substantially in a plane of the transverse reinforcement layer and perpendicular to the carbon fibers in the composite layer. Heat generating and heat dissipating components are bonded to the thermal/structural base. Metallic contact strips are bonded to the surfaces of the transverse reinforcement layers.
REFERENCES:
patent: 4689110 (1987-08-01), Leibovitz
patent: 4812792 (1989-03-01), Leibovitz
patent: 4849858 (1989-07-01), Grapes et al.
patent: 4888247 (1989-12-01), Zweben et al.
patent: 4963414 (1990-10-01), LeVasseur et al.
patent: 4963425 (1990-10-01), Buchanan et al.
patent: 5103293 (1992-04-01), Bonafino et al.
patent: 5111359 (1992-05-01), Montesano
patent: 5296310 (1994-03-01), Kibler et al.
patent: 5390734 (1995-02-01), Voorhes et al.
patent: 5424916 (1995-06-01), Martin
patent: 5834337 (1998-10-01), Unger et al.
Bulante Roderick A.
Conwell Troy A.
Duncan Gary L.
Lee Sung H.
Quan Dennis
Chervinsky Boris L.
Grunebach Georgann S.
Hughes Electronics Corporation
Picard Leo P.
Sales M. W.
LandOfFree
Composite heat sink/support structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composite heat sink/support structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite heat sink/support structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1810531