Composite flanged ceramic package for electronic devices

Details Composite flanged ceramic package for electronic devices Composite flanged ceramic package for electronic devices

1978-09-18

1980-10-07

Goldberg, Elliot A.

Electricity: conductors and insulators

With fluids or vacuum

With cooling or fluid feeding, circulating or distributing

174 52FP, 357 81, 403 30, H05K 720

Patent

active

042270367

ABSTRACT:
An improved ceramic-based package for electronic devices having a composite flange for heat dissipation comprising a layer of heat conducting metal having a thermal coefficient of expansion appreciably different from that of the base secured to the base and a second layer of metal secured to the first layer having a thermal coefficient of expansion approximately equal to that of the ceramic. In a preferred embodiment, the first layer is copper, and the second is molybdenum.

REFERENCES:
patent: 3823772 (1974-07-01), Larering et al.
patent: 3898594 (1975-08-01), Hochberg et al.
patent: 4025997 (1977-05-01), Gernitis et al.

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