Composite fins for heat sinks

Details Composite fins for heat sinks Composite fins for heat sinks

2005-03-01

2005-03-01

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S709000, C361S719000, C257S722000, C174S016300, C165S080300, C165S185000, C029S890030

Reexamination Certificate

active

06862183

ABSTRACT:
A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.

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