Composite film comprising low-dielectric resin and paraoriented

Details Composite film comprising low-dielectric resin and paraoriented Composite film comprising low-dielectric resin and paraoriented

1998-04-08

2000-09-19

Copenheaver, Blaine

Fabric (woven, knitted, or nonwoven textile or cloth, etc.)

Woven fabric

Woven fabric with a preformed polymeric film or sheet

442291, 442286, 4283084, B32B 2734

Patent

active

061211710

ABSTRACT:
Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300.degree. C. of within .+-.50.times.10.sup.-6 /.degree.C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.

REFERENCES:
patent: 4895752 (1990-01-01), McEwen
patent: 5851646 (1998-12-01), Takahashi et al.

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