Composite epoxy glass-microsphere-dielectrics for electronic coa

Details Composite epoxy glass-microsphere-dielectrics for electronic coa Composite epoxy glass-microsphere-dielectrics for electronic coa

1979-09-26

1980-12-09

Welsh, John D.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

174110E, 260 37EP, 264172, 428 36, H01R 500, H02G 1306

Patent

active

042386411

ABSTRACT:
A composite epoxy/glass-microsphere-dielectric for hermetic R.F. connectors and coaxial cables is provided. A material which is a composition of moisture resistant epoxy resin, curing agent, glass microspheres, and silane coupling agent provide a low dielectric constant material to be molded into the various geometrics required for hermetic R.F. connectors and coaxial cables.

REFERENCES:
patent: 2997527 (1961-08-01), Kessel et al.
patent: 3446741 (1969-05-01), Hervig et al.
patent: 3573976 (1971-04-01), Duane
Marsden, Polymer Eng. and Sci., pp. 97-112 (Apr., 1966).
Adam, Microwave Journal, pp. 50-54, Jul. 1976.

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