Composite enclosure for electronic hardware

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156264, 156268, 264152, 264258, 264324, B29C 6900, B29C 7000, B32B 3118

Patent

active

057003424

ABSTRACT:
An enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material.

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