Stock material or miscellaneous articles – Hollow or container type article – Polymer or resin containing
Patent
1996-02-02
1998-10-27
Ryan, Patrick
Stock material or miscellaneous articles
Hollow or container type article
Polymer or resin containing
428 361, 428 363, 428167, 428175, 428 357, 428 354, 428408, 442 57, 174 35MS, 361609, 361689, 361702, 361715, 361809, 361831, B32B 900
Patent
active
058275851
ABSTRACT:
An enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material.
REFERENCES:
patent: H526 (1988-09-01), Miller
patent: 3219747 (1965-11-01), McAdams
patent: 3654521 (1972-04-01), LaSelle
patent: 3992653 (1976-11-01), Richardson et al.
patent: 4004194 (1977-01-01), Doerflinger et al.
patent: 4227037 (1980-10-01), Layton
patent: 4316925 (1982-02-01), Delmonte
patent: 4356228 (1982-10-01), Kobayashi et al.
patent: 4486494 (1984-12-01), Eldin
patent: 4496621 (1985-01-01), Hubert et al.
patent: 4530949 (1985-07-01), Atkinson et al.
patent: 4608453 (1986-08-01), Freeman
patent: 4664971 (1987-05-01), Soens
patent: 4678699 (1987-07-01), Kritchevsky
patent: 4731698 (1988-03-01), Millot et al.
patent: 4775260 (1988-10-01), Keemer
patent: 4785136 (1988-11-01), Mollet et al.
patent: 4791236 (1988-12-01), Klein et al.
patent: 4961990 (1990-10-01), Yamada et al.
patent: 5016141 (1991-05-01), Lorig et al.
patent: 5035942 (1991-07-01), Nagata et al.
patent: 5115104 (1992-05-01), Bunyan
patent: 5118560 (1992-06-01), Tredway
patent: 5136119 (1992-08-01), Leyland
patent: 5137594 (1992-08-01), Asada et al.
patent: 5217770 (1993-06-01), Morris, Jr. et al.
patent: 5289347 (1994-02-01), McCarthy
patent: 5520976 (1996-05-01), Gianetti
Donegan, Thermal Connection for Circuit Package, IBM Technical Disclosure Bulletin, vol. 13, No. 7, Dec. 1970.
Camloc Products Division, P.C. Board Fasteners, Selector Guide, Camloc Fastener Technology Sets New Standards for P.C. Board Access, pp. E-1-E-3.
Glatz et al. Application of Advanced Composites in Sem-E Heatsinks for the Thermal Management of Avionics, 5th International SAMPE Electronics Conference, Jun. 18-20, 1991, pp. 451-467.
Runnacles et al, Heat Treatment of Mesophase Pitch Based Low/Intermediate Modulus Fibers for C-C Applications, pp. 33-53 (1992).
Morgan, Applications of Composite Material Systems to Avionic Systems Packaging, (1991).
Riley, Composite Heat Transfer Materials for Electronic Packaging in Future Dod Systems, pp. 2-M-1-2-M-14 (1991).
Riley/Kesapradist, Advanced Composites Tailored For Use In Electronic Packaing, Conference date Feb. 3, 1992.
Glatz et al, Application of Resin and Metal Matrix Composites to Advanced Avionics Enclosure, 5th International SAMPE Electronics Conference, Jun. 18-20, 1991, pp. 434-450.
JP 61-029161, Patent Abstract of Japan, "Thermal Conductive Cooling Module Device", Feb., 1986.
JP 62-029151, Patent Abstract of Japan, "Cooling Module For Semiconductor Device", Feb., 1987.
European Search Report for EP 94 30 4799 mailed May 29, 1995.
Lewis Leonard L.
Ryan Patrick
Simmonds Precision Products Inc.
Zitelli William E.
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